Redefine the boundaries of the dispensing process with disruptive precision, providing reliable, efficient and consistent precision dispensing solutions for high-end intelligent manufacturing
ADW ROBOTICS has in-depth insight into the ultimate requirements for dispensing processes in high-end manufacturing fields such as semiconductor packaging and testing, chip mounting and 3C precision assembly, and has successfully developed a new generation of ultra-high-precision dispensing series products. With the core technologies such as meticulous motion control, intelligent positioning and multi-axis linkage
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Chip mounting
ADW ROBOTICS dispensing robot supports the synchronous execution of single-point continuous and linear dispensing, allowing you to synchronize the two major processes of positioning filling and trajectory coating within a single production beat. This not only doubles the efficiency, but also fundamentally improves the overall dispensing accuracy and consistency of the product -
Semiconductor packaging and testing
ADW ROBOTICS High-precision Dispensing Series products are by no means limited to supporting multiple widths, but also precisely controls each width. With the core intelligent algorithm, we ensure that the glue lines under any trajectory are uniform and consistent, without any faults or undermines, and redefine the dispensing accuracy standards with excellent performance. -
3C Precision Assembly
With intelligent three-dimensional path planning and real-time adaptive control technology, ADW ROBOTICS dispensing robots easily conquer various complex surfaces such as planes, curved surfaces, concave and convex surfaces. Ensure that in every dispensing operation, the height, angle and flow of the glue are perfectly matched with the product outline, achieving full-area fit and high-standard output with consiste
